Thin Film on LTCC for Connectivity and Conductivity
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
سال: 2011
ISSN: 2380-4491
DOI: 10.4071/cicmt-2011-tp35